The company, leading the AI memory market, is investing $13 billion in a new HBM packaging plant.
The post How SK Hynix Redefined the Memory Market appeared first on EE Times.
The company, leading the AI memory market, is investing $13 billion in a new HBM packaging plant.
The post How SK Hynix Redefined the Memory Market appeared first on EE Times.
Former AI chip startup Quadric, now an AI IP supplier, plans to rapidly increase its headcount.
The post Quadric Raises Series C For Programmable NPU IP appeared first on EE Times.
On January 9, 2026, the CES concluded successfully in Las Vegas, USA, reaffirming its status as the premier global event for the consumer electronics industry. At the Venetian Convention Center, Telink Semiconductor showcased its latest generation of SoC chips alongside five immersive technology demonstrations. Highlights included true 8K wireless gaming solutions, advanced Edge AI intelligent noise cancellation, innovative Bluetooth® Channel Sounding, and multi-device […]
The post Telink Semiconductor Showcases AIoT Wireless Innovations at CES 2026 appeared first on EE Times.
Toshiba has integrated its SmartMCD for dual brushed DC motors into the Mikroe’s SmartMCD TB9M001FTG board. The board enables automotive system engineers to design the TB9M001FTG smart motor control driver ...
The post Toshiba SmartMCD integrated into Mikroe automotive board appeared first on Electronics Weekly.
ST’s SRK1004 synchronous-rectifier controllers save space and increase efficiency in the secondary side of active-clamp, resonant, and quasi-resonant flyback (ACF, AHB, QR) converters for chargers, power adapters, and switched-mode power ...
The post 2mm x 2mm synchronous-rectifier controllers appeared first on Electronics Weekly.
GeoCue, the LiDAR mapping specialist, has signed Coptrz the drone vendor to distribute its products in the UK to expand access to aerial mapping technology for surveyors and engineers. Coptrz ...
The post GeoCue signs Coptrz appeared first on Electronics Weekly.