High-density switching supplies help modernize legacy aircraft power systems while addressing obsolescence, efficiency, integration, and compliance challenges.

The post Transitioning Legacy Aircraft Power Architectures to High-Density Switching Supplies appeared first on EE Times.

CopperPilot’s CEO said the startup has built its AI design agent so that “no hardware team is ever blocked because a board is too hard to design.”

The post CopperPilot Raises Pre-seed to Develop AI Agent for PCB Design appeared first on EE Times.

Quantum computing’s future depends on measuring useful processing power against energy consumption and cost, not just qubit counts.

The post Quantum Computing’s Energy Bill Is Coming, and We Haven’t Priced It In appeared first on EE Times.

Getting the most power from an urban-sited panel requires deep understanding of its surroundings.

The post Using a Single Image to Optimize Urban Solar-Panel Orientation appeared first on EE Times.

Stricter European safety assessment criteria are prompting car companies to replace steering-wheel sensors with consolidated in-cabin systems.

The post Automakers Reconsider In-Cabin Sensing for Euro NCAP Ratings appeared first on EE Times.

Having watched some fun videos on repurposed satellite dishes on YouTube, [Melan] wanted to get in on the action. She managed to source herself an Intellian i4, a dish built …read more

Airborne micro particles can be a significant health hazard in a workshop, and thus it’s important to maintain a high standard of ventilation. But monitoring their concentration is also important, …read more

If we care to cast an eye over the history of ubiquitous personal computing as we know it today, we might immediately point at the original IBM PC. After all, …read more

The humble credit card reader — most of us have used hundreds, perhaps even thousands of them over the years. But even for folks like us, it’s not the sort …read more

Many readers will be familiar with Douglas Englebart’s 1968 so-called “Mother of All Demos”, in which he described many of the devices and technologies we would be using two or …read more

Vinod Chugani has published a four-stage study plan for computer vision engineers at KDnuggets. Each stage builds on the one before it, and each ends with a portfolio exercise. Stage one is the math: matrix transformations, coordinate frames, projective geometry, and multi-view geometry, plus PyTorch tensor work and augmentation with Albumentations. Stage two covers Vision […]

A free 550 page e-book collects classic Hewlett-Packard test gear from the 1950s to the 1990s, with photos, schematics notes and restoration tips. Most of the instruments covered are ones the writer owns and tested. Sections cover voltmeters, including the 400H vacuum tube voltmeter and the 410C with its photoconductive chopper amplifier, the 8640B signal […]

Writing at LWN.net, jzb reports that CPython’s experimental just-in-time compiler is being removed. The JIT landed in CPython in 2024 for the 3.13 release. In June, the Python steering council paused work on the JIT in CPython’s main branch. The council wanted an accepted Python Enhancement Proposal first, one that addressed maintenance and compatibility concerns […]

Zo Ahmed, writing for TechSpot, covered nxnative, an open-source project that converts Switch games a user already owns into native iPhone, iPad, and Mac apps. There is no emulator. The game’s original Arm code runs directly on Apple silicon. Only the Nintendo-specific parts get replaced: a small host program stands in for the Switch operating […]

Lolren has published nrf54-arduino-core on GitHub, an Arduino core for Nordic’s nRF54L family that talks to the hardware at the register level. There is no Zephyr runtime underneath and no separate nRF Connect SDK install. Targets include the Seeed XIAO nRF54L15 and XIAO nRF54LM20A, HOLYIOT modules, generic modules and the Nordic nRF54L15 DK. The usual […]

Yesterday, Anduril  and Qualcomm said they had developed a prototype of a ruggedised laptop assembled in the US with 90% of its components sourced in the US. They call it […]

The post Anduril and Qualcomm hook up for ruggedised laptop appeared first on Electronics Weekly.

Lam and imec are collaborating to accelerate manufacturing readiness for 3D integration technologies supporting advanced packaging and next-generation memory. By bringing together Lam’s capabilities in deposition and etch with imec’s […]

The post Lam and Imec pursue 3-D integration appeared first on Electronics Weekly.

Japan, like the UK, is embroiled in the net zero versus economic reality argument. Prime Minister Sanae Takaichi is for trimming subsidies on EVs , funding growth investments and cutting […]

The post Japan argues Emissions vs Net Zero appeared first on Electronics Weekly.

Infineon intends to build the first high-volume 300mm GaN fab by investing around €1.1 billion in its llVillach site by 2034. The EU is contributing €319 million towards the cost. […]

The post Infineon to put €1.1bn into GaN fab appeared first on Electronics Weekly.

Panasonic has expanded its EVP-BD, EVP-0B, EVP-CD, and EVP-BX Series of 6.0mm x 6.0mm SMD top-push, 2-terminal tactile switches with the introduction of the EVP-BX (quiet-type) switch. The new addition […]

The post Panasonic adds to EVP series of tactile switches appeared first on Electronics Weekly.