Projected retail food waste of $540 billion in 2026 is driving adoption of improved RFID labels for perishables.
The post How RFID Labels Could Help Tackle $540B Food Waste Losses in 2026 appeared first on EE Times.
Projected retail food waste of $540 billion in 2026 is driving adoption of improved RFID labels for perishables.
The post How RFID Labels Could Help Tackle $540B Food Waste Losses in 2026 appeared first on EE Times.
The Made in Taiwan report examines Taiwan’s technology industry, focusing on its role in semiconductor manufacturing, power electronics, embedded systems design, and AI. The small island of Taiwan is a global leader in chip manufacturing, packaging, design, and test, and its position in the global economy is only getting larger as it bolsters its system integration capabilities. As Taiwan sets the next stage […]
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A Quick Look Back: How AI Got Started Artificial intelligence (AI) began in the 1950s with rule-based systems. Over time, machine learning and deep learning enabled AI to learn from data. By the 2010s, AI powered voice assistants, recommendation engines, and self-driving cars. As AI matured, centralized cloud computing revealed limitations—especially in real-time, privacy-sensitive, and power-constrained applications. This led to progression (figure […]
The post From AI’s Origins to Smart Devices: Selecting the Right Devices for Smart Deployment appeared first on EE Times.
SatVu, the London-based thermal infrared satellite specialist, has raised £30m ($40m) in its latest funding round, lead by the NATO Innovation Fund. This brings its total equity funding to £60m ...
The post NATO Innovation Fund leads £30m funding for SatVu thermal intelligence appeared first on Electronics Weekly.
Electron projection lithography (EPL) is moving out of the R&D lab and into manufacturing evaluation sites, according to chip consortiums International Sematechr and Selete. That’s the word from the 2003 ...
The post EPL – Always The Bridesmaid Never The Bride appeared first on Electronics Weekly.
Rohm is using its new HPLF5060 package (4.9mm × 6.0mm) to expand its lineup of low-voltage (40V/60V) MOSFETs for automotive applications. For example, main inverter control circuits, electric pumps, and ...
The post Rohm fits HPLF5060 package for automotive, low-voltage MOSFETs appeared first on Electronics Weekly.