Rohm Semiconductor retains wafer fabrication in-house as it expands its back-end semiconductor operations and R&D footprint in India.

The post Rohm Semiconductor Expands Back-End Chip Manufacturing Outsourcing appeared first on EE Times.

See how Synopsys uses agentic AI to orchestrate trusted EDA tools for precise, explainable chip design, and faster engineering workflows.

The post Can AI Be Trusted? Synopsys on Agentic AI and Autonomous Engineering appeared first on EE Times.

Gopi Sirineni says AI’s bottleneck is power, not chips, and autonomous rack controllers can boost efficiency up to 30%.

The post Why AI’s Limit Is Power, Not Chips: Gopi Sirineni at AI Infra Summit 2026 appeared first on EE Times.

For AMD CTO Mark Papermaster, tailored computing and holistic design are key to delivering AI.

The post AMD’s Mark Papermaster: Exclusive Video Interview at World Summit AI appeared first on EE Times.

Join this session where our expert will examine key power technologies, design considerations, and best practices that help manufacturers enhance product quality, accelerate qualification, and reduce risk.

The post Engineering Reliability: Power Architectures for High-Performance Burn-In appeared first on EE Times.

We’ve seen plenty of game console projects here, many of them that seek to produce a miniature game console. But this one from [RayTriangle] may break a new barrier entirely …read more

Retrocomputing is more than just hardware. It’s also a feel, a vibe, and [valkyrie0528]’s Retro Terminal Bartop Arcade Topper has it in spades. Here’s how it happened. The gorgeous device …read more

Before HDMI and DVI there was VGA, and before that? TTL RGB, in which instead of analogue voltages, the connector carried TTL logic voltages. TTL monitors used to be ten …read more

As the legacy AM broadcast bands fade away, what happens to the millions of devices built to receive them? Many of them will go into e-waste, but with a century …read more

There comes a point where you have to acknowledge that your beloved console is out of date and– barring the odd homebrew title– won’t be playing new games ever again. …read more

mgm86 shares: A desk-mounted cable organizer that keeps frequently-used cables accessible on the desktop rather than lost behind the desk. Available in 3, 5, or 7-tube configurations. Tubes rotate 180° to open/close with snap-latch mechanism. Attaches via double-sided adhesive tape (designer recommends masking tape as intermediate layer for sensitive surfaces). Main body simply pushes onto […]

rajmaks shares: A 3D-printable spider + web Halloween decoration (250×125×2mm). Dual-color PLA print using black and red filaments. 0.2mm first layer, 0.08mm subsequent layers for quality. Three plates total. Red PLA element attaches to spider without adhesive; double-sided tape secures web to surfaces. Bonus plate includes fridge-mounted spiders with 8×1.5mm magnet holes. Bambu support filament […]

shamix3d shares: An interactive Halloween pumpkin with a Scotch Yoke mechanism that converts rotational motion into linear motion — rotating both hands opens the mouth. Prints across 2 plates: pumpkin parts, plus light diffuser + head lifter. Compatible with the usual Bambu Lab printer lineup (P1S, P1P, X1, X1 Carbon, A1, A1 Mini, H2D, H2S, […]

Rousie shares: A robust portable enclosure that transforms an ESP32-based Cheap Yellow Display into a multifunctional handheld. Holds 4× 18650 batteries, space for a power bank board (charging functionality), SMA connectors for multiple antennas. Dedicated bays: GPS, NFC, IR, RF (315/433MHz), CC1101, NRF24L01, and speaker modules. PETG-CF recommended at 0.2mm layer, 25–30% infill. Designed for […]

BenBurnski shares: Model is divided into multiple individual parts and can be printed on printers with a min. build volume of 220x220x220mm download the files on: Every Thursday is #3dthursday here at Adafruit! The DIY 3D printing community has passion and dedication for making solid objects from digital models. Recently, we have noticed electronics […]

Check out the launch of Google's Project Suncatcher prototype datacentre satellite, with its Trillium TPUs (Tensor Processing Units). It's courtesy of SpaceX's Transporter-18 rideshare mission.

The post Pic of the Day: Google’s Project Suncatcher datacentre satellite in orbit appeared first on Electronics Weekly.

As the communications network moves into the millimetre-wave spectrum connectivity becomes a larger challenge, writes Dr Tudor Williams. As satellite constellations expand 5G infrastructure becomes more densely deployed and defence […]

The post Connectivity challenges evolve as systems move into higher-frequency operation appeared first on Electronics Weekly.

SuperSharp, a specialist in ultra-high resolution thermal infrared (TIR) imaging from space, has been chosen to lead Europe’s THEOSCOPE Mission. This is an Earth observation project with €4 million of […]

The post SuperSharp to lead THEOSCOPE IR Earth observation mission appeared first on Electronics Weekly.

Yesterday the Qualcomm vs Arm case covered the struggle for leverage, differing architectural interpretations and good faith (or not) in the negotiations regarding Arm’s v10 technology. A major focus was […]

The post Qualcomm vs Arm (day 3) appeared first on Electronics Weekly.

Intel and Applied are getting together for a multi-site, multi-technology collaboration on process technology. The work will cover front-end and back-end, transistor development, packaging, interconnect and power delivery. The work […]

The post Intel and Applied hook up on process appeared first on Electronics Weekly.