The March 2026 Edition of EE Times Europe Magazine analyzes how AI is transforming factory automation and operations and reviews Europe's de-risking semiconductor strategy.
The post EE Times Europe Magazine – March 2026 appeared first on EE Times.
The March 2026 Edition of EE Times Europe Magazine analyzes how AI is transforming factory automation and operations and reviews Europe's de-risking semiconductor strategy.
The post EE Times Europe Magazine – March 2026 appeared first on EE Times.
Jensen Huang was crowned 'The Inference King' with Groq-powered Rubin CPUs, unveiling dramatic architectural leaps at GTC this year.
The post GTC 2026 Keynote: Long Live the Inference King appeared first on EE Times.
Telink unveiled TL322X SoC and ML3228A module at Embedded World 2026, featuring dual-core RISC-V, multi-protocol support including Bluetooth, Zigbee, Thread, Matter, 2.4GHz Proprietary, and automotive-grade AEC-Q100 certification for IoT applications.
The post Telink TL322X+ML3228A Launched at Embedded World 2026 appeared first on EE Times.
China’s dancing, jumping, performing humanoid robots are fun but useless, said TSMC CEO C C Wei (pictured) when accepting a doctorate from Asia University at the weekend. “It’s useless — ...
The post China dancing robots useless appeared first on Electronics Weekly.
Sansung plans to invest $73 billion this year to keep up with TSMC in the chip business. TSMC expects to spend $52-56 billion on capex and $7 billion on R&D ...
The post Samsung to spend $73bn on chip capex and R&D appeared first on Electronics Weekly.
PC units will fall 11.3% this year and tablet units will fall 7.6%, says the IDC Worldwide Quarterly Personal Computing Device Tracker. These reductions are driven by memory shortages, rising ...
The post 2026 PC units down 11.3%, tablet units down 7.9%, but revenues up. appeared first on Electronics Weekly.