Rohm Semiconductor retains wafer fabrication in-house as it expands its back-end semiconductor operations and R&D footprint in India.

The post Rohm Semiconductor Expands Back-End Chip Manufacturing Outsourcing appeared first on EE Times.

See how Synopsys uses agentic AI to orchestrate trusted EDA tools for precise, explainable chip design, and faster engineering workflows.

The post Can AI Be Trusted? Synopsys on Agentic AI and Autonomous Engineering appeared first on EE Times.

Gopi Sirineni says AI’s bottleneck is power, not chips, and autonomous rack controllers can boost efficiency up to 30%.

The post Why AI’s Limit Is Power, Not Chips: Gopi Sirineni at AI Infra Summit 2026 appeared first on EE Times.

For AMD CTO Mark Papermaster, tailored computing and holistic design are key to delivering AI.

The post AMD’s Mark Papermaster: Exclusive Video Interview at World Summit AI appeared first on EE Times.

Join this session where our expert will examine key power technologies, design considerations, and best practices that help manufacturers enhance product quality, accelerate qualification, and reduce risk.

The post Engineering Reliability: Power Architectures for High-Performance Burn-In appeared first on EE Times.

Retrocomputing is more than just hardware. It’s also a feel, a vibe, and [valkyrie0528]’s Retro Terminal Bartop Arcade Topper has it in spades. Here’s how it happened. The gorgeous device …read more

Before HDMI and DVI there was VGA, and before that? TTL RGB, in which instead of analogue voltages, the connector carried TTL logic voltages. TTL monitors used to be ten …read more

As the legacy AM broadcast bands fade away, what happens to the millions of devices built to receive them? Many of them will go into e-waste, but with a century …read more

There comes a point where you have to acknowledge that your beloved console is out of date and– barring the odd homebrew title– won’t be playing new games ever again. …read more

We covered [Nick Bild]’s mini Atari console using original devices not so long ago, and today he’s back with the same console wrapped up with a CRT as a handheld. …read more

Rousie shares: A robust portable enclosure that transforms an ESP32-based Cheap Yellow Display into a multifunctional handheld. Holds 4× 18650 batteries, space for a power bank board (charging functionality), SMA connectors for multiple antennas. Dedicated bays: GPS, NFC, IR, RF (315/433MHz), CC1101, NRF24L01, and speaker modules. PETG-CF recommended at 0.2mm layer, 25–30% infill. Designed for […]

BenBurnski shares: Model is divided into multiple individual parts and can be printed on printers with a min. build volume of 220x220x220mm download the files on: Every Thursday is #3dthursday here at Adafruit! The DIY 3D printing community has passion and dedication for making solid objects from digital models. Recently, we have noticed electronics […]

TYnextnext shares: A magnetic work-holding solution that snaps onto any steel print surface (or any ferrous work surface) to securely hold PCBs for soldering, probing, rework, and photos. Adjustable clamps and low-profile form factor. Requires M4×12mm bolts, M4 nuts, and 8×2mm or 10×2mm neodymium disc magnets. Recommended: PETG or ABS for heat resistance (PLA OK […]

Fierro_3D shares: A spooky shelf-edge decoration featuring a ghostly figure that appears to drip and melt over the edge — artistic aesthetic suited for Halloween displays. Requires supports for the hanging position and overhangs (careful orientation matters). Two print profiles: standard version (1.7 hours) and a larger version (5.1 hours) designed to accommodate an LED […]

From the mail bag! Hello Adafruit team, Your CircuitPython introduction makes a lovely point: after a board is set up, saving an edited file is enough to run the change. That short distance between an idea and its result makes experimentation feel approachable. Thank you for explaining the process so clearly and for building a […]

SuperSharp, a specialist in ultra-high resolution thermal infrared (TIR) imaging from space, has been chosen to lead Europe’s THEOSCOPE Mission. This is an Earth observation project with €4 million of […]

The post SuperSharp to lead THEOSCOPE IR Earth observation mission appeared first on Electronics Weekly.

Yesterday the Qualcomm vs Arm case covered the struggle for leverage, differing architectural interpretations and good faith (or not) in the negotiations regarding Arm’s v10 technology. A major focus was […]

The post Qualcomm vs Arm (day 3) appeared first on Electronics Weekly.

Intel and Applied are getting together for a multi-site, multi-technology collaboration on process technology. The work will cover front-end and back-end, transistor development, packaging, interconnect and power delivery. The work […]

The post Intel and Applied hook up on process appeared first on Electronics Weekly.

Wolfspeed has received a conditional loan commitment letter from the U.S. Department of War (“DoW”), through its Office of Strategic Capital (“OSC”), for up to $1.5 billion. The money will […]

The post Wolfspeed gets $1.5bn loan from US government appeared first on Electronics Weekly.

Infineon and ZuriQ, the Swiss quantum computing company spun out of ETH Zurich, are to expand their collaboration to scale qubits. The partnership combines ZuriQ’s trapped-ion quantum computing architecture with […]

The post Infineon and ZuriQ to scale qubits appeared first on Electronics Weekly.