EE Times News
Built-In Memory. Built-In Confidence.
Published: June 17, 2026, 1:00 pm
Memory shortages put edge AI at risk. NVIDIA Jetson™ integrates validated LPDDR5 DRAM on-module—giving teams a faster, confident path to production.
The post Built-In Memory. Built-In Confidence. appeared first on EE Times.
Beyond Chiplets, CMOS 2.0 Moves Scaling into the Circuit
Published: June 17, 2026, 12:47 pm
Imec’s Zsolt Tokei and Arm’s Mohamed Awad explain why CMOS 2.0 could redefine semiconductor scaling beyond chiplets.
The post Beyond Chiplets, CMOS 2.0 Moves Scaling into the Circuit appeared first on EE Times.
AI Isn’t the Real Bottleneck in Autonomy; Wireless Is
Published: June 17, 2026, 8:37 am
The future of drones, robotics, and autonomous systems will depend not only on AI, but also on reliable communications in congested, contested, and degraded environments.
The post AI Isn’t the Real Bottleneck in Autonomy; Wireless Is appeared first on EE Times.
EE Times Magazine – June 2026
Published: June 16, 2026, 10:30 pm
The June 2026 edition of EE Times Magazine explores autonomous aerospace and defense systems—from orbital data centers to AI-enabled drones.
The post EE Times Magazine – June 2026 appeared first on EE Times.
SiMa Launches Agentic Development Environment for Physical AI
Published: June 16, 2026, 5:50 pm
Edge AI chip company said it can speed up engineer productivity when transferring to its hardware from months to hours.
The post SiMa Launches Agentic Development Environment for Physical AI appeared first on EE Times.
Hackaday News
Ask Hackaday: What Ever Happened to the Hero Nerd?
Published: June 17, 2026, 2:00 pm
Knowing absolutely nothing about you other than the fact that you’re currently reading Hackaday, I can predict with a high degree of certainty that we’re both fond of at least …read more
An Orbital StormWall Could Mitigate The Next Carrington Event
Published: June 17, 2026, 11:00 am
The Carrington Event was the most intense geomagnetic storm ever recorded. In September 1859, auroras were visible as close to the equator as Columbia and some telegraph stations were severely …read more
Building an Organic Flow Battery Based on Green Tea
Published: June 17, 2026, 8:00 am
As simple of a concept flow batteries are, the used chemicals can still be somewhat problematic in the context of a school experiment. To this end [Markus Bindhammer] decided to …read more
Security Camera Gets Several Defensive Upgrades
Published: June 17, 2026, 5:00 am
Ever since the early web, people have been streaming video with inexpensive webcams, and since the advent of the Raspberry Pi and its dedicated camera slot we’ve really seen how …read more
The Problem of Making a Good Metal-To-Glass Seal
Published: June 17, 2026, 2:00 am
If you’ve ever taken a close look at a vacuum tube, you’ll have seen the seals around the pins that keep everything air-tight while providing the the device’s electrical contacts. …read more
Adafruit Blog News
Bluefruit LE Feather Robot Rover
Published: June 17, 2026, 4:00 pm
Control this tiny 2-wheel drive robot with your phone! This little 3-wheeled robot can be put together in just an hour or two, and is a great place to start (or continue!) the adventure into robotics. You can control it with your iOS or Android phone over Bluetooth using Adafruit Bluefruit LE Connect! Check out […]
A header-only message serialization library for C++17 with zero dynamic memory allocation
Published: June 17, 2026, 3:26 pm
BytePack is a header-only C++17 Arduino library for serializing plain C++ structs into compact, portable byte buffers. A message is any struct that lists its fields in a single io() member function; that one function drives serialization, deserialization and compile-time size counting, so the field list is written once and can never get out of sync. The wire […]
Inject molten plastic into your 3D prints to knit the layers together #3dThursday
Published: June 17, 2026, 3:14 pm
Magma is a fork of OrcaSlicer by MGunlogson on GitHub. It adds a triangle-like infill type that builds sealed vertical U-shaped channels inside your part, then injects plastic into them mid-print using the printer’s nozzle. The problem FDM parts are strong in XY and weak in Z. Bonding weakness on the layer lines results in […]
LIVE! 3D Hangouts with Noe and Pedro
Published: June 17, 2026, 3:00 pm
3D Hangouts – GPS Compass, Prop It Game and Gliding Manta Ray This week @adafruit we’re releasing the guide and video for the Prop It Game. Making progress on our GPS compass. This week’s timelapse features a gliding manta ray. Prop It Guide: Prop It YouTube Video Feather RP2040 Propmaker: Alpanumeric […]
The Python on Microcontrollers Newsletter: subscribe for free
Published: June 17, 2026, 2:59 pm
The Python for Microcontrollers Newsletter is the place for the latest news involving Python on hardware (microcontrollers AND single board computers like Raspberry Pi). This ad-free, spam-free weekly email is filled with CircuitPython, MicroPython, and Python information that you may have missed, all in one place! You get a summary of all the software, events, projects, and the latest hardware worldwide once a week, no […]
Electronics Weekly News
Confusion Over Tesla FSD
Published: June 17, 2026, 1:00 pm
US Senators Edward Markey of Massachusetts and Richard Blumenthal of Connecticut have written to the US National Highway Traffic Safety Administration (NHTSA) saying the analysis underlying Tesla’s Full Self Driving ...
The post Confusion Over Tesla FSD appeared first on Electronics Weekly.
Switzerland hits peak deep tech investment levels
Published: June 17, 2026, 8:30 am
Switzerland has taken first place in the countries ranked according to the share of venture capital per capita that is spent on deep tech. The Swiss Deep Tech Report 2026 ...
The post Switzerland hits peak deep tech investment levels appeared first on Electronics Weekly.
E6 and Orbray establish process for 3-inch diamond wafers
Published: June 17, 2026, 5:28 am
Element Six (E6) of Oxford and Orbray of Tokyo have established a reproducible process for 3-inch wafer-scale single crystal (WSC) diamond, representing a significant step change in size, uniformity and ...
The post E6 and Orbray establish process for 3-inch diamond wafers appeared first on Electronics Weekly.
Power SiC market growing at 20% CAGR 2025-31 to $11bn
Published: June 17, 2026, 5:19 am
The power SiC market is forecast to be worth $11 billion by 2031 growing at 20% CAGR between 2025 and 2031, fuelled by AI datacentres, 800V EVs, and renewable energy ...
The post Power SiC market growing at 20% CAGR 2025-31 to $11bn appeared first on Electronics Weekly.
FRAM scaled to 22nm
Published: June 17, 2026, 5:16 am
FRAM has been scaled to the 22nm manufacturing node using an innovative 3D capacitor architecture. By vertically integrating ferroelectric capacitors made from hafnium zirconium oxide (HZO) thin films, CEA-Leti researchers ...
The post FRAM scaled to 22nm appeared first on Electronics Weekly.