Memory shortages put edge AI at risk. NVIDIA Jetson™ integrates validated LPDDR5 DRAM on-module—giving teams a faster, confident path to production.

The post Built-In Memory. Built-In Confidence.  appeared first on EE Times.

Imec’s Zsolt Tokei and Arm’s Mohamed Awad explain why CMOS 2.0 could redefine semiconductor scaling beyond chiplets.

The post Beyond Chiplets, CMOS 2.0 Moves Scaling into the Circuit appeared first on EE Times.

The future of drones, robotics, and autonomous systems will depend not only on AI, but also on reliable communications in congested, contested, and degraded environments.

The post AI Isn’t the Real Bottleneck in Autonomy; Wireless Is appeared first on EE Times.

The June 2026 edition of EE Times Magazine explores autonomous aerospace and defense systems—from orbital data centers to AI-enabled drones.

The post EE Times Magazine – June 2026 appeared first on EE Times.

Edge AI chip company said it can speed up engineer productivity when transferring to its hardware from months to hours.

The post SiMa Launches Agentic Development Environment for Physical AI appeared first on EE Times.

Knowing absolutely nothing about you other than the fact that you’re currently reading Hackaday, I can predict with a high degree of certainty that we’re both fond of at least …read more

The Carrington Event was the most intense geomagnetic storm ever recorded. In September 1859, auroras were visible as close to the equator as Columbia and some telegraph stations were severely …read more

As simple of a concept flow batteries are, the used chemicals can still be somewhat problematic in the context of a school experiment. To this end [Markus Bindhammer] decided to …read more

Ever since the early web, people have been streaming video with inexpensive webcams, and since the advent of the Raspberry Pi and its dedicated camera slot we’ve really seen how …read more

If you’ve ever taken a close look at a vacuum tube, you’ll have seen the seals around the pins that keep everything air-tight while providing the the device’s electrical contacts. …read more

Frederick Blais has taken PebbleOS, the smartwatch operating system, and made two ports for Raspberry Pi RP2350 boards: Adafruit Fruit Jam RP2350 with a Waveshare/Pebble-compatible 144×168 Sharp Memory LCD, DS1307-compatible external RTC support, and ESP32-C6 HCI UART Bluetooth. Raspberry Pi Pico 2 W with the shared RP2350 display, time, storage, resource, and USB CDC profile […]

image via The Pudding   Dive into the deep end of similes with Russell Samora’s Comparisons as Predictable as the Sunrise, featuring design and illustration by Shelly Tan. It’s a fun read that I wish I had stumbled across earlier in the day when my brain was a bit firmer. Nothing exemplifies the specialist better […]

Summer is about to be in full swing and nothing (NOTHING) is like summer in NYC. So if you’ll be in the greatest city in the world this summer, check out some or all of the art shows in Hyperallergic’s list! And then, of course, there are the wildcards that make this city such a […]

Come on by for JP’s Product Pick of The Week ! A new product pick will be revealed. The show airs at 4pm ET / 1pm PT, TODAY! Check out the livestream right here inside this product page you won’t want to miss it because there will be a BEEEG DISCOUNT during the show! Tune […]

RP2350 no-MMU Linux Buildroot ports This GitHub repo builds tiny Buildroot-based Linux images for RP2350 RISC-V (Hazard3) boards. The original target is the Raspberry Pi Pico 2 / SparkFun Pro Micro RP2350 work; this branch adds an Adafruit Fruit Jam RP2350B bring-up target. The Fruit Jam target is named adafruit_fruit_jam_rp2350. It uses: RV32 RISC-V Hazard3, no […]

US Senators Edward Markey of Massachusetts and Richard Blumenthal of Connecticut have written to the US National Highway Traffic Safety Administration (NHTSA) saying the analysis underlying Tesla’s Full Self Driving ...

The post Confusion Over Tesla FSD appeared first on Electronics Weekly.

Switzerland has taken first place in the countries ranked according to the share of venture capital per capita that is spent on deep tech. The Swiss Deep Tech Report 2026 ...

The post Switzerland hits peak deep tech investment levels appeared first on Electronics Weekly.

Element Six (E6) of Oxford and Orbray of Tokyo have established a reproducible process for 3-inch wafer-scale single crystal (WSC) diamond, representing a significant step change in size, uniformity and ...

The post E6 and Orbray establish process for 3-inch diamond wafers appeared first on Electronics Weekly.

The power SiC market is forecast to be worth $11 billion by 2031 growing at 20% CAGR between 2025 and 2031, fuelled by AI datacentres, 800V EVs, and renewable energy ...

The post Power SiC market growing at 20% CAGR 2025-31 to $11bn appeared first on Electronics Weekly.

FRAM has been scaled to the 22nm manufacturing node using an innovative 3D capacitor architecture. By vertically integrating ferroelectric capacitors made from hafnium zirconium oxide (HZO) thin films, CEA-Leti researchers ...

The post FRAM scaled to 22nm appeared first on Electronics Weekly.