Fixed logic or software? eFPGA offers a smarter middle ground—enabling reconfigurable, ASIC-class signal processing without the re-spin. Here's how to architect it.
The post Integrating eFPGA for Hybrid Signal Processing Architectures appeared first on EE Times.
Discover 6G use cases, key drivers, evolving network architecture, hardware innovation, and sustainable, energy-efficient networks in this article.
The post Exploring the Next-Gen of Network Communication appeared first on EE Times.
New Gartner data suggests AI agents will force a major restructuring of the corporate ladder, expecting reduced junior headcount.
The post Supply Chain Leaders See Agentic AI Curbing Entry-Level Hiring appeared first on EE Times.
Eyeing near infrared (NIR) hyperspectral imaging applications, Hamamatsu is releasing its G17242/G17243-0808T 2D InGaAs area image sensors. Aimed at both R&D and industrial engineering, possible applications include food inspection, material ...
The post Hamamatsu 2D InGaAs area image sensors for NIR hyperspectral imaging appeared first on Electronics Weekly.
Electronics Weekly is proud to announce that TeenTech is this year’s charity partner for our Women Leaders in Electronics Awards. And we can also confirm the venue in central London ...
The post TeenTech charity partners for Women Leaders in Electronics Awards appeared first on Electronics Weekly.
Vishay Intertechnology is introducing a new series of AEC-Q200 qualified thick film chip resistors in the ultra compact 0201 case size: the CRCW0201-AT e3 series. They have a miniature footprint ...
The post CRCW0201-AT e3 resistors feature miniature footprint appeared first on Electronics Weekly.
