Xcena’s MX1 uses CXL to push compute into memory by combining DDR5, SSDs, and RISC-V cores while easing programmability.
The post Xcena Cuts Data Movement to Address Memory Bottlenecks appeared first on EE Times.
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Xcena’s MX1 uses CXL to push compute into memory by combining DDR5, SSDs, and RISC-V cores while easing programmability.
The post Xcena Cuts Data Movement to Address Memory Bottlenecks appeared first on EE Times.
NSING Technologies, a Singapore-founded semiconductor company, delivers full-stack chip solutions for industrial automation, AI data centers, and digital energy.The N32-series MCUs (144–600 MHz, Cortex-M4F/M7) integrate EtherCAT, CAN-FD, USB-HS, and high-precision ADCs, powering servo drives, inverters, and PLCs with wide-temperature and EFT immunity. For industrial security, TPM 2.0-based hardware root-of-trust chips enable secure boot, device authentication, […]
The post Full-Stack Semiconductor Solutions for Smart, Secure Industry and Digital Energy appeared first on EE Times.
Kirin 9050 Pro rests on the Tau (τ) Scaling Law, marking a major change in chip architecture designed to bypass EUV lithography limits.
The post Huawei’s Tau Law Takes Commercial Form appeared first on EE Times.
As edge AI transforms smart buildings, Wi-Fi HaLow bridges the gap between bandwidth, long range, and low power.
The post Balancing Bandwidth, Range, and Power in Intelligent Buildings appeared first on EE Times.
Delos’s Apollo chiplet is designed to bridge different endpoint semantics and interconnects, creating a low-latency domain spanning GPUs, accelerators, CPUs and memory
The post Delos Data Targets Heterogeneous AI with Data Interface appeared first on EE Times.
Molex is announcing VersaBeam Mini its ultra-compact, 16-fiber Expanded Beam Optical (EBO) connector. The company says it solves critical space, thermal and maintenance challenges in high-density AI and hyperscale networks. […]
The post VersaBeam Mini 16-fiber EBO connector for high-density AI networks appeared first on Electronics Weekly.
UK electrical manufacturers reported a sharp sales slowdown in Q2 2026, according to BEAMA‘s latest Market Pulse. Four in ten (40.7%) manufacturers reported operating at 70% capacity or below, while […]
The post Q2 slowdown reports BEAMA appeared first on Electronics Weekly.
Raspberry Pi H1 revenue was up 90% YoY at $256.9 million, driven by a 17% increase in board shipments to 4.2 million units and a 42% rise in ASP. “Raspberry […]
The post Raspberry Pi H1 revenue up 90% appeared first on Electronics Weekly.
Elon Musk expects that, by Christmas, xAI’s models will be as advanced as those from Anthropic and Open AI, “We will keep accelerating,” said Musk, “our AI efforts are only […]
The post xAi’s models to catch up OpenAI and Anthropic by year-end appeared first on Electronics Weekly.
Wise Integration, which specialises in a digital control for GaN and SiC based power converters, and Navitas Semiconductor, the GaN and SiC specialist, are to collaborate on advancing power-computing applications […]
The post Wise Integration and Navitas Semi hook up for data centre PSU development appeared first on Electronics Weekly.